Our solutions for 3D inspection with ZFokus
- 3D inspection of connector parts
- Planarity inspection of electronic components
(Connector pins, SMD parts)
- 3D inspection of small injection-moulded parts
- General: three dimensional height measurement with high resolution in a small field of view
Small in size – big in accuracy.
New developments in 3D inspection offer unprecedented possibilities not only for the acquisition of surface information, from shape, location and position, but also in the high resolution 3D inline inspection of small components.
With the ZFokus camera developed by us, a Depth-from-Focus based 3D camera, components up to a size of 12 x 12 mm with an accuracy of 0.01 mm in the Z direction can be inspected. Until now, this method of 3D inspection of small objects is primarily known from the field of microscopy and has now been further advanced to an industry compatible product for inline inspection and is fully integrated into a PC-based image analysis framework.
The ZFokus camera shows it’s strengths especially in areas where high resolution in a small field is required. Where other 3D methods such as laser line triangulation or strip light projection of highly textured surfaces reach their limits, with ZFokus important details can be measured and analysed. This new method has been proven in the height measurement of connector pins and planarity inspection of electronic components.
Field of view: 12 mm x 12 mm (max.)
Resolution: 4 Megapixel, greyscale or colour
Scan duration: dependent on Z range, 1-4 seconds
Accuracy: lateral: 15 µm, Z: ≥ 0.01 mm
We are happy to advise you and can offer a complete solution for your 3D inspection project.